The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2009
Filed:
Mar. 22, 2007
Hideo Sonohara, Kanagawa, JP;
Taro Sakurabayashi, Kanagawa, JP;
Hideo Sonohara, Kanagawa, JP;
Taro Sakurabayashi, Kanagawa, JP;
NEC Electronics Corporation, Kanagawa, JP;
Abstract
A semiconductor integrated circuit device of improved wireability, fewer number of wiring layers and strengthened power supply includes a plurality of power pads placed on a semiconductor chip and a plurality of signal pads placed on the semiconductor chip and configured to have a width less than that of the power pads. The signal pads and the power pads are placed in the uppermost wiring layer among a plurality of wiring layers. Signal wiring connecting I/O cells and signal pads is disposed in the uppermost wiring layer. First power wiring electrically connecting the I/O cells and first power pads is disposed in the uppermost wiring layer. Second power wiring connecting internal circuits and second power pads is disposed in the uppermost wiring layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile