The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2009
Filed:
May. 18, 2006
Dong-ha Sim, Seoul, KR;
In-sang Song, Seoul, KR;
Duck-hwan Kim, Goyang-si, KR;
Yun-kwon Park, Dongducheon-si, KR;
Seok-chul Yun, Suwon-si, KR;
Kuang-woo Nam, Yongin-si, KR;
Dong-ha Sim, Seoul, KR;
In-sang Song, Seoul, KR;
Duck-hwan Kim, Goyang-si, KR;
Yun-kwon Park, Dongducheon-si, KR;
Seok-chul Yun, Suwon-si, KR;
Kuang-woo Nam, Yongin-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A packaging chip having inductors therein is provided. The packaging chip includes a substrate for mounting a circuit element therein, at least one port formed on a surface of the substrate, a sealing portion electrically connected on the substrate to the circuit element and the at least one port, respectively, and a packaging substrate bonded to the substrate through the sealing portion and packaging the circuit element. In this case, the sealing portion has a certain magnitude of inductance since it is formed of a conductive material, thereby serving as an inductor. Accordingly, the packaging chip having an inductor therein can be implemented in a small size.