The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2009
Filed:
Oct. 26, 2005
Eiichi Soda, Ibaraki, JP;
Hitoshi Ishimori, Ibaraki, JP;
Eiichi Soda, Ibaraki, JP;
Hitoshi Ishimori, Ibaraki, JP;
NEC Electronics Corporation, Kanagawa, JP;
Abstract
A method for manufacturing an electronic device, in which a via hole and a trench for an interconnect are integrally provided in an interlayer insulating film formed on a substrate, and the via hole and the trench for the interconnect are plugged with an electric conductor film is provided. The method includes: forming a via hole in the interlayer insulating film; forming a resin film plugging the via hole on the interlayer insulating film; etching the resin film exposed outside the via hole off with an etching gas mainly containing an active hydrogen species to form a dummy plug composed of the resin film in the via hole; forming a resist mask having an opening for an interconnect on the dummy plug and on the interlayer insulating film.