The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2009

Filed:

Feb. 10, 2006
Applicants:

Mitchell M. Hamamoto, San Jose, CA (US);

Yioao Chen, Jiangsu, CN;

Kim Hwee Tan, Jiangsu, CN;

Inventors:

Mitchell M. Hamamoto, San Jose, CA (US);

Yioao Chen, Jiangsu, CN;

Kim Hwee Tan, Jiangsu, CN;

Assignee:

California Micro Devices, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A manufacturing method of a semiconductor device with a copper redistribution line, a copper inductor and aluminum wire bond pads and the integration of the resulting device with an integrated circuit on a single chip, resulting in the decreased size of the chip.


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