The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2009
Filed:
Oct. 14, 2005
Charles C Haluzak, Corvallis, OR (US);
Chien-hua Chen, Corvallis, OR (US);
David M Craig, Albany, OR (US);
Charles C Haluzak, Corvallis, OR (US);
Chien-Hua Chen, Corvallis, OR (US);
David M Craig, Albany, OR (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
A method of forming a device package having an edge interconnect pad includes forming an array of MEMS devices overlaying at least one conductive via that electrically connects to an underlying layer. The method continues with depositing, by way of a damascene process, a conductive material on a substrate that is coplanar with the array of MEMS devices, the conductive material coupling to the at least one conductive via. The method also includes covering the array of MEMS devices and the conductive material with a passivation layer.