The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2009

Filed:

Feb. 15, 2006
Applicants:

Shingo Miyata, Tokyo, JP;

Atsushi Yamaguchi, Tokyo, JP;

Inventors:

Shingo Miyata, Tokyo, JP;

Atsushi Yamaguchi, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A plating apparatus for plating a substrate comprises a power supply for generating a voltage between a pair of terminals; an anode connected to one terminal of the power supply; a main cathode connected to the other terminal of the power supply while in contact with the substrate; an auxiliary cathode connected to the other terminal of the power supply while out of contact with the substrate; a main resistance Rconnected in series between the other terminal of the power supply and the main cathode; and an auxiliary resistance Rconnected in series between the other terminal of the power supply and the auxiliary cathode.


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