The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2009
Filed:
Aug. 19, 2004
Kohichi Ohsumi, Shiga, JP;
Kaoru Kobayashi, Shiga, JP;
Kohichi Ohsumi, Shiga, JP;
Kaoru Kobayashi, Shiga, JP;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A printed wiring board having a through hole conductor formed on the surface of a through hole formed in a copper-clad laminate board, and on the surface of the copper-clad laminate boardin the vicinity of an opening of the through hole. The through hole conductor is filled with a positive photosensitive resin. A capped conductor is formed on the positive photosensitive resin and is coupled to the through hole conductor. Further, a circuit pattern is formed on the surface of the copper-clad laminate board. An insulating layer is formed on the surface of the copper-clad laminate board, capped conductor, and the circuit pattern, and formed with a via hole extending from the surface of the insulating layer to the capped conductor. A via conductor is formed inside the via hole and on the surface of the insulating layer in the vicinity of an opening of the via hole.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile