The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2009

Filed:

Feb. 16, 2007
Applicants:

Norman Chow, Milpitas, CA (US);

Paul Tsao, Los Altos, CA (US);

Douglas E. Werner, Santa Clara, CA (US);

Mark Mcmaster, Menlo Park, CA (US);

Girish Upadhya, Cupertino, CA (US);

Frederic Landry, San Francisco, CA (US);

Ian Spearing, Westerville, OH (US);

Tim Schrader, Irwin, OH (US);

Inventors:

Norman Chow, Milpitas, CA (US);

Paul Tsao, Los Altos, CA (US);

Douglas E. Werner, Santa Clara, CA (US);

Mark McMaster, Menlo Park, CA (US);

Girish Upadhya, Cupertino, CA (US);

Frederic Landry, San Francisco, CA (US);

Ian Spearing, Westerville, OH (US);

Tim Schrader, Irwin, OH (US);

Assignee:

Cooligy Inc., Mountain View, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.


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