The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2009
Filed:
Oct. 20, 2004
Kuo-huang Hsieh, Taipei, TW;
Man-kit Leung, Taipei, TW;
King-fu Lin, Taipei, TW;
Wen-yen Chiu, Taipei, TW;
Wen-chang Chen, Taipei, TW;
Lee-yih Wang, Taipei, TW;
Wen-bin Liau, Taipei, TW;
Chi-an Dai, Taipei, TW;
Wei-fang Su, Taipei, TW;
Hung-chun Chang, Taipei, TW;
Hung-ren Wang, Taipei, TW;
Chao-hui Kuo, Taipei, TW;
Chi-shin Lee, Taipei, TW;
Jun-ming Huang, Taipei, TW;
Cheng-yuan Shih, Taipei, TW;
Kuo-Huang Hsieh, Taipei, TW;
Man-Kit Leung, Taipei, TW;
King-Fu Lin, Taipei, TW;
Wen-Yen Chiu, Taipei, TW;
Wen-Chang Chen, Taipei, TW;
Lee-Yih Wang, Taipei, TW;
Wen-Bin Liau, Taipei, TW;
Chi-An Dai, Taipei, TW;
Wei-Fang Su, Taipei, TW;
Hung-Chun Chang, Taipei, TW;
Hung-Ren Wang, Taipei, TW;
Chao-Hui Kuo, Taipei, TW;
Chi-Shin Lee, Taipei, TW;
Jun-Ming Huang, Taipei, TW;
Cheng-Yuan Shih, Taipei, TW;
National Taiwan University, Taipei, TW;
Abstract
The present invention discloses a method by utilizing chemical reaction or specific attractive forces (complexation or hydrogen bonding) for forming self-synthesizing conductive or conjugated polymer film and its application. First of all, at least one photoresist layer with a first functional group and a specific pattern is formed, so that the first functional group can bond a second functional group of a conductive or conjugated polymer unit, whereby a conductive or conjugated polymer film with specific pattern is formed. Furthermore, this invention can be applied for forming emitting films, especially for forming emitting layers of OLED/PLED elements.