The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2009
Filed:
Sep. 13, 2004
Yoshifumi Takeyama, Shiga, JP;
Yoshifumi Takeyama, Shiga, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A thermal contact-bonding method employs a thermal contact-bonding apparatus including at least a hot plate, an upper chamber, and a resin sheet provided at a lower portion of the upper chamber. The method includes the steps of pressing the upper chamber against the hot plate, while at least a part of a surface of the hot plate is separated from the resin sheet, to be in a stand-by state of the thermal contact-bonding apparatus, for a time of not charging a material to be processed, charging the material to be processed between the resin sheet and the hot plate, and subjecting the material to be processed to a thermal contact-bonding processing by making a space between the resin sheet and the hot plate under a vacuum state.