The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2009

Filed:

Oct. 17, 2007
Applicants:

Siew S. Hiew, San Jose, CA (US);

Jin Kyu Kim, San Jose, CA (US);

Abraham C. MA, Fremont, CA (US);

Ming-shiang Shen, Taipei Hsien, TW;

Inventors:

Siew S. Hiew, San Jose, CA (US);

Jin Kyu Kim, San Jose, CA (US);

Abraham C. Ma, Fremont, CA (US);

Ming-Shiang Shen, Taipei Hsien, TW;

Assignee:

Super Talent Electronics, Inc., San Jose, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is retractably mounted into an external housing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The housing includes a retractable mechanism that facilitates selective exposure of metal contacts, either by sliding a front portion of the modular USB core component into and out of a front opening of the housing, or by providing a cover plate that slidably covers the front portion of the modular USB core component.


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