The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2009

Filed:

Jun. 28, 2005
Applicants:

Munehiro Yoshida, Austin, TX (US);

Daniel Stasiak, Austin, TX (US);

Michael F. Wang, Austin, TX (US);

Charles R. Johns, Austin, TX (US);

Hiroki Kihara, Austin, TX (US);

Tetsuji Tamura, Tokyo, JP;

Kazuaki Yazawa, Chiba, JP;

Iwao Takiguchi, Kanagawa, JP;

Inventors:

Munehiro Yoshida, Austin, TX (US);

Daniel Stasiak, Austin, TX (US);

Michael F. Wang, Austin, TX (US);

Charles R. Johns, Austin, TX (US);

Hiroki Kihara, Austin, TX (US);

Tetsuji Tamura, Tokyo, JP;

Kazuaki Yazawa, Chiba, JP;

Iwao Takiguchi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
Abstract

Systems and methods for positioning thermal sensors within an integrated circuit in a manner that provides useful thermal measurements corresponding to different parts of the integrated circuit. In one embodiment, an integrated circuit includes multiple, duplicate functional blocks. A separate thermal sensor is coupled to each of the duplicate functional blocks, preferably in the same relative location on each of the duplicate functional blocks, and preferably at a hotspot. One embodiment also includes thermal sensors on one or more functional blocks of other types in the integrated circuit. One embodiment includes a thermal sensor positioned at a cool spot, such as at the edge of the integrated circuit chip. Each of the thermal sensors may have ports to enable power and ground connections or data connections between the sensors and external components or devices.


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