The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2009
Filed:
May. 14, 2004
Shinichi Ito, Tokyo, JP;
Shigeki Maekawa, Tokyo, JP;
Hiroya Ikuta, Tokyo, JP;
Shigeharu Nagai, Tokyo, JP;
Toshiaki Kashihara, Tokyo, JP;
Shinji Iwamoto, Tokyo, JP;
Takahiro Sonoda, Tokyo, JP;
Shinichi Ito, Tokyo, JP;
Shigeki Maekawa, Tokyo, JP;
Hiroya Ikuta, Tokyo, JP;
Shigeharu Nagai, Tokyo, JP;
Toshiaki Kashihara, Tokyo, JP;
Shinji Iwamoto, Tokyo, JP;
Takahiro Sonoda, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Chiyoda-Ku, Tokyo, JP;
Abstract
An objective is to provide a pressure-contact type rectifier in which solder that increases the environmental load is not used, and neither burning nor breakage of a rectifying device occurs, even if temperature of the rectifying device increases due to current flowing or force towards outside the rectifying device is applied to a lead end, etc. By providing an electrically conductive friction reducer on at least one electrode face of the rectifying device, the temperature increase can be prevented, and the friction at the contact face can be reduced. Moreover, by providing a flexible portion on the lead end outside a cap, and fixing the flexible portion to the cap, the contact area between the lead and the rectifying device can be kept constant. As a result, a pressure-contact type rectifier in which neither burning nor breakage of the rectifying device occurs can be obtained.