The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2009
Filed:
Feb. 20, 2003
Shinji Tai, Okayama, JP;
Kaoru Ikeda, Okayama, JP;
Haruhisa Masuda, Osaka, JP;
Tomoyuki Watanabe, Okayama, JP;
Kouta Isoyama, Okayama, JP;
Shinji Tai, Okayama, JP;
Kaoru Ikeda, Okayama, JP;
Haruhisa Masuda, Osaka, JP;
Tomoyuki Watanabe, Okayama, JP;
Kouta Isoyama, Okayama, JP;
Kuraray Co., Ltd., Kurashiki-shi, JP;
Abstract
Provided is a resin composition comprising 1-99% by weight of a modified ethylene-vinyl alcohol copolymer (C) having an ethylene content of 5-55 mol %, which contains a specific structural unit (I) in an amount of 0.3-40 mol % and can be obtained by reacting an ethylene-vinyl alcohol copolymer (A) with a monofunctional epoxy compound (B) having a molecular weight of not more than 500, and 1-99% by weight of a thermoplastic resin (T1) other than (C). Moreover, a multilayer structure in which the resin composition and a thermoplastic resin (T2) are laminated is also provided. Thus, a resin composition superior in barrier properties, transparency, stretchability, flexibility, flexing resistance and interlayer adhesiveness and various kinds of molded articles made thereof are provided.