The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2009
Filed:
Nov. 07, 2006
Yoshihiro Ogawa, Yokohama, JP;
Kazuhiko Ueno, Tokyo, JP;
Yoshihiro Ogawa, Yokohama, JP;
Kazuhiko Ueno, Tokyo, JP;
Stanley Electric Co., Ltd., Tokyo, JP;
Abstract
A surface mount electronic device manufacturing method can produce surface mount devices at a high yield rate and high productivity by reducing warp of a circuit board. The reduced warp avoids problems in processes for dicing the circuit board. Surface mount LED devices made in accordance with the method can have high reliability and reduced non-uniformity in color tone. The method can include providing an adhesive sheet having window holes at predetermined intervals. The adhesive sheet can be adhered to the circuit board. An attachable board having window holes provided at corresponding positions to the window holes of the adhesive sheet can be adhered to the adhesive sheet. LED chips or other semiconductor devices, laser diodes, etc., can be mounted on the circuit board and located at positions corresponding to bottoms of the window holes. A thermosetting resin can be filled in the window holes for encapsulating the LED chips, etc. The surface mount devices can then be produced by dicing the circuit board.