Method of arranging dies in a wafer for easy inkless partial wafer process

Abstract

In a method and system for fabricating a full wafer () having dies, an orientation marker (), and a reference die (), includes configuring a reticle pattern () that is configured by arranging the dies in an array having m rows and n columns, where the m rows start in a row adjacent to the orientation marker (), and m and n are integers. The reticle pattern () is transferred to the full wafer () to sequentially form a portion of the dies. The transferring includes placing an inkless marker () in the form of one or more non-circuit dies between the n columns of adjacent reticle patterns. The reticle pattern () is repeatedly transferred to form a remaining portion of the dies to complete the full wafer (). A wafer map for the full wafer () is stored, with the wafer map including a non-circuit bin containing data describing the inkless marker ().