The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2009

Filed:

Dec. 01, 2003
Applicants:

Naoki Wakita, Himeji, JP;

Mitsuteru Mutsuda, Himeji, JP;

Hiroaki Arita, Himeji, JP;

Hajime Komada, Himeji, JP;

Toru Ikuta, Kobe, JP;

Inventors:

Naoki Wakita, Himeji, JP;

Mitsuteru Mutsuda, Himeji, JP;

Hiroaki Arita, Himeji, JP;

Hajime Komada, Himeji, JP;

Toru Ikuta, Kobe, JP;

Assignee:

Daicel-Evonik Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/34 (2006.01); B32B 27/40 (2006.01); B28B 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a molded composite article formed by directly joining a resin member comprising a polyamide-series resin to a resin member comprising a thermoplastic polyurethane-series resin, as the polyamide-series resin, a polyamide-series resin having an amino group of not less than 10 mmol/kg is used. The molded composite article may be produced by heating at least any one of the polyamide-series resin and the thermoplastic polyurethane-series resin to join to the other resin.


Find Patent Forward Citations

Loading…