The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2009
Filed:
Sep. 10, 2004
Masayuki Ibaraki, Toyonaka, JP;
Kenji Iwamoto, Toyonaka, JP;
Masayuki Ibaraki, Toyonaka, JP;
Kenji Iwamoto, Toyonaka, JP;
Japan New Metals Co., Ltd., Osaka, JP;
Abstract
A sintered sputtering target for forming a high purity metal Mo thin film having a remarkably little particle generation is provided. A high purity metal Mo coarse powder as a raw material is provided for making this target. The sintered sputtering target has a theoretical density ratio of 98% or more. The target is obtained by sintering the high purity metal Mo coarse powder. This particle powder has the high purity of 99.99 or more % by mass and an average particle diameter of 5.5 to 7.5 μm.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile