The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2009

Filed:

Sep. 06, 2005
Applicants:

Brian E. Bottema, Austin, TX (US);

Stephen F. Abraham, Austin, TX (US);

Alex P. Pamatat, Austin, TX (US);

Inventors:

Brian E. Bottema, Austin, TX (US);

Stephen F. Abraham, Austin, TX (US);

Alex P. Pamatat, Austin, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01); B24B 49/00 (2006.01); B24B 51/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polish pad () and platen () assembly for use in chemical mechanical polishing of semiconductor devices includes a platen () having a grooved or channeled surface () which is sealed from the processing environment by an ungrooved portion () at the periphery of the platen (). In addition, the platen () includes one or more passageways () that provide a pathway to ambient or sub-ambient environment. The combination of the sealing region () and the passageway(s) () prevent liquids, vapors or other undesirable contaminants from infiltrating between the pad and platen, and also vent trapped air pockets between the pad and platen.


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