The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2009
Filed:
Mar. 31, 2004
Peter N. Comley, Sumner, WA (US);
Larry D. Hefti, Auburn, WA (US);
Peter N. Comley, Sumner, WA (US);
Larry D. Hefti, Auburn, WA (US);
The Boring Company, Chicago, IL (US);
Abstract
A method for superplastically forming and/or diffusion bonding a structural member and an associated structural member are provided. The structural member is formed at least partially of titanium, e.g., Ti-6A1-4V, and has a fine grain structure. For example, the grain size of the material of the structural member can be less than 2 micron. The member can be superplastically formed and/or diffusion bonded at a reduced temperature, thereby potentially reducing the thermal energy required for forming and bonding, and also reducing the effects of heating on the structural member and the forming apparatus. In addition, the structural member can be formed at an increased strain rate.