The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2009
Filed:
May. 18, 2006
Junichi Kimura, Aichi, JP;
Kazuhiko Honjo, Gifu, JP;
Eiji Kawamoto, Osaka, JP;
Shinji Harada, Gifu, JP;
Motoyoshi Kitagawa, Gifu, JP;
Junichi Kimura, Aichi, JP;
Kazuhiko Honjo, Gifu, JP;
Eiji Kawamoto, Osaka, JP;
Shinji Harada, Gifu, JP;
Motoyoshi Kitagawa, Gifu, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A multilayer module includes a parts-containing module whose circuit board has been mounted at one surface with an electronic component and the electronic component is covered with a resin layer. Connection terminals are provided either at the resin layer or at the other surface of the circuit board, and a through hole is provided for connection between the two surfaces of the module. Also included is a module, which is provided with connection terminals at a place corresponding to the connection terminal, and the through hole for connection between the connection terminals and electronic component. An insulation layer is disposed between conductor layers, the insulation layer having a conductive bond for connection between connection terminals, respectively. Locations of a through hole and an electronic component in the module are not restricted by a location of the through hole.