The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2009
Filed:
Mar. 30, 2006
Applicants:
Bruno Michel, Adliswil, CH;
Thomas J. Brunschwiler, Thalwil, CH;
Ryan J. Linderman, Zurich, CH;
Hugo E. Rothuizen, Adliswil, CH;
Urs Kloter, Dietikon, CH;
Inventors:
Bruno Michel, Adliswil, CH;
Thomas J. Brunschwiler, Thalwil, CH;
Ryan J. Linderman, Zurich, CH;
Hugo E. Rothuizen, Adliswil, CH;
Urs Kloter, Dietikon, CH;
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 7/00 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by using flexible, interlocking posts attached to the surfaces of the chip and the heat sink.