The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2009

Filed:

Jul. 12, 2006
Applicants:

Wei-chieh Sun, Taipei County, TW;

Ching-chuan Chen, Taipei, TW;

Wei-hsiung Huang, Hsinchu, TW;

Shu-i Huang, Taipei, TW;

Inventors:

Wei-Chieh Sun, Taipei County, TW;

Ching-Chuan Chen, Taipei, TW;

Wei-Hsiung Huang, Hsinchu, TW;

Shu-I Huang, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1333 (2006.01); G02F 1/1345 (2006.01);
U.S. Cl.
CPC ...
Abstract

An active matrix substrate including a substrate, a pixel array, and a peripheral circuit is provided. The substrate has a display region and a peripheral circuit region adjacent thereto. The pixel array is disposed in the display region. The peripheral circuit is disposed in the peripheral circuit region and includes a first signal line, a second signal line, a first bypass-line, a second bypass-line, a plurality of chip bonding pads, a first dummy bonding pad and a plurality of second dummy bonding pads. The first bypass-line and the first signal line transmit the same signal. The second bypass-line and the second signal line transmit the same signal. The chip bonding pads are disposed between the bypass-lines and the pixel array, and are connected to the pixel array. The first dummy bonding pad is connected to the first bypass-line. Each second dummy bonding pad is connected to the second bypass-line.


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