The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2009
Filed:
Apr. 26, 2005
Eiichi Hosomi, Austin, TX (US);
Yuichi Goto, Austin, TX (US);
Eiichi Hosomi, Austin, TX (US);
Yuichi Goto, Austin, TX (US);
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
Systems and methods for a structure for a package substrate for use in a semiconductor package are disclosed. Package substrates formed according to the systems and methods of the present invention may exhibit improved signal integrity and quality. In order to achieve this increase signal integrity, these systems and methods may endeavor to obtain equalization, or matching, of impedances in signal traces in or on the package substrate by removing material from one or more layers of a package substrate in a region of high signal density. Removing material from these layers may serve to increase the impedance of a signal trace within a region of high signal density such that the impedance of the signal trace with the region of high signal density is substantially matched to the impedance of the signal trace outside the region of high-signal density.