The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2009

Filed:

May. 26, 2005
Applicants:

Johann Rieger, Bad Abbach, DE;

Stefan Lipp, Neumarkt, DE;

Hans Peter Zeindl, Altdorf, DE;

Thomas Detzel, Villach, AT;

Hubert Maier, Villach, AT;

Inventors:

Johann Rieger, Bad Abbach, DE;

Stefan Lipp, Neumarkt, DE;

Hans Peter Zeindl, Altdorf, DE;

Thomas Detzel, Villach, AT;

Hubert Maier, Villach, AT;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods for forming an integrated semiconductor circuit arrangement are disclosed. In one embodiment, a semiconductor circuit with a first semiconductor circuit region and with a second semiconductor circuit region is formed in each case in a semiconductor material region. A first metallization layer is applied to the structure thus obtained. A protective material region is then formed. A second metallization layer is subsequently applied, which is then also patterned. Afterward, the first metallization layer together with the protective material region is then patterned.


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