The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2009
Filed:
Oct. 31, 2006
Applicants:
Wai Yew Lo, Selangor, MY;
Heng Keong Yip, Selangor Darul Ehsan, MY;
Inventors:
Wai Yew Lo, Selangor, MY;
Heng Keong Yip, Selangor Darul Ehsan, MY;
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An array QFN package () includes a first semiconductor package () and a lead frame () having a plurality of leads (). A first IC die () is attached on a first side to the first semiconductor package () and is electrically connected to the leads () of the lead frame (). A mold compound () encapsulates the first IC die (), a portion of the first semiconductor package () and a portion of the leads () such that a plurality of I/O terminals () on the semiconductor package () is exposed.