The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2009
Filed:
Aug. 25, 2005
Applicants:
Brian Ormond, Kanagawa, JP;
Masaki Kobayashi, Kanagawa, JP;
Toshimichi Iwamori, Kanagawa, JP;
Inventors:
Assignee:
Fuji Xerox Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/26 (2006.01); G02B 6/42 (2006.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
A substrate is bonded to a semiconductor integrated circuit to which plural solder bumps have been adhered. The substrate includes: plural contact portions that are disposed at positions corresponding to the positions of the plural solder bumps and include contact surfaces which contact the solder bumps; and a guidance structure that is disposed in the contact surfaces and, when the solder bumps are melted, guides the melted solder bumps to predetermined regions within the contact surfaces. The predetermined regions are set so that the semiconductor integrated circuit and the substrate are properly aligned.