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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7528487 B1

PDFFull Text
Expired
Date of Patent:
May. 05, 2009

Filed:

Nov. 30, 2004

Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring board

Applicant:

Hideo Imai, Shimosuwa-machi, JP;

Inventor:

Hideo Imai, Shimosuwa-machi, JP;

Assignee:

Seiko Epson Corporation, , JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Luan C Thai

Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 23/40 (2006.01); H01L 23/485 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device including: a semiconductor chip including a substrate, an outer-connection electrode, and a bump, wherein the bump has a first conductive layer and a second conductive layer provided on the first conductive layer, and the second conductive layer is made of copper; a wiring board having a land; and an insulating material dispersed with conductive particles, wherein the conductive particles connect between the bump and the land, wherein an electrical connection is established by the conductive particles having penetrated to both the second conductive layer and the land.

Find Patent Forward Citations

Imai, Hideo. (2009). Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring board (U.S. Patent No. 7528487). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7528487

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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