The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2009
Filed:
Nov. 17, 2005
Hsueh-kuo Liao, Taoyuan Hsien, TW;
Hsin-chang Tsai, Taoyuan Hsien, TW;
Tai-kang Shing, Taoyuan Hsien, TW;
Hsueh-Kuo Liao, Taoyuan Hsien, TW;
Hsin-Chang Tsai, Taoyuan Hsien, TW;
Tai-Kang Shing, Taoyuan Hsien, TW;
Delta Electronics, Inc., Taoyuan Hsien, TW;
Abstract
A chip package mechanism. A substrate is disposed in a receiving chamber of a base. A chip is disposed on a target surface of the substrate. A plurality of supporting elements is disposed on the target surface and surrounds the chip. A gap for receiving the chip is created in the receiving chamber and between the target surface and the base by means of the supporting elements. A barricade is disposed in the gap to separate glue filled in the receiving chamber from contacting the chip. Outside water and particles cannot enter the chip package mechanism. The chip thus has a prolonged lifespan after packaged in the chip package mechanism.