The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2009

Filed:

Jun. 02, 2005
Applicants:

Haruo Kawakita, Okazaki, JP;

Koji Ando, Kariya, JP;

Inventors:

Haruo Kawakita, Okazaki, JP;

Koji Ando, Kariya, JP;

Assignee:

Denso Corporation, Kariya, Aichi-Pref., JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

Semiconductor equipment includes: a first lead frame having a first semiconductor device; a second lead frame having a second semiconductor device; a thermal resistor for preventing heat transfer from the first lead frame to the second lead frame; and a temperature sensitive device for detecting operational temperature of the first semiconductor device. The first lead frame is separated from the second lead frame by a predetermined distance. The thermal resistor is disposed in a clearance between the first lead frame and the second lead frame. The second semiconductor device controls to restrict operation of the first semiconductor device when the operational temperature of the first semiconductor device is higher than a predetermined temperature.


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