The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2009

Filed:

Feb. 08, 2007
Applicants:

Tien-fu Huang, Hsinchu County, TW;

Chin-yin Yu, Yilan County, TW;

Kuo-chang HU, Miaoli County, TW;

Shyh-rong Tzan, Hsinchu County, TW;

Shi-how Hua, Changhua County, TW;

Inventors:

Tien-Fu Huang, Hsinchu County, TW;

Chin-Yin Yu, Yilan County, TW;

Kuo-Chang Hu, Miaoli County, TW;

Shyh-Rong Tzan, Hsinchu County, TW;

Shi-How Hua, Changhua County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/0224 (2006.01);
U.S. Cl.
CPC ...
Abstract

A light emitting diode (LED) package structure is disclosed. The LED package structure comprises a lead frame which has a chip carrier part, a pair of extended parts, a first electrode and a second electrode. The chip carrier part has an arc frame, a bulge, a first surface and a second surface. The extended part has a first side, a second side, a first top and a first bottom. The first side connects the arc frame of the chip carrier part. The arc frame electrically connects the first electrode. A heat dissipating material is placed on the second surface.


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