The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2009
Filed:
Sep. 14, 2004
Yoshitsugu Morita, Chiba Prefecture, JP;
Masayoshi Terada, Chiba Prefecture, JP;
Hiroji Enami, Chiba Prefecture, JP;
Tomoko Kato, Chiba Prefecture, JP;
Yoshitsugu Morita, Chiba Prefecture, JP;
Masayoshi Terada, Chiba Prefecture, JP;
Hiroji Enami, Chiba Prefecture, JP;
Tomoko Kato, Chiba Prefecture, JP;
Dow Corning Toray Company, Ltd., Tokyo, JP;
Abstract
A curable organopolysiloxane composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group per molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group per molecule, and having siloxane units represented by the general formula: RsiO, (C) a linear organopolysiloxane with both terminal ends of the molecular chain blocked by silicon bonded hydrogen atoms having at least one aryl group per molecule, and (D) a hydrosilation reaction catalyst, and a semiconductor device whose semiconductor elements are coated with the cured product of the above-described composition. The curable organopolysiloxane composition shows low viscosity, excellent filling properties, and excellent curability that cures to form a soft cured product of a large refractive index, high light transmittance, and high adhesion to substrates, as well as the semiconductor device shows superior reliability.