The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2009

Filed:

Mar. 27, 2006
Applicants:

Jay K. Lahti, Shoreview, MN (US);

Andrew J. Ries, Lino Lakes, MN (US);

Hui J. Jin, Shoreview, MN (US);

David G Schaenzer, Minneapolis, MN (US);

Inventors:

Jay K. Lahti, Shoreview, MN (US);

Andrew J. Ries, Lino Lakes, MN (US);

Hui J. Jin, Shoreview, MN (US);

David G Schaenzer, Minneapolis, MN (US);

Assignee:

Medtronic, Inc., Minneapolis, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

IPG connector headers for implantable medical devices are provided. In one embodiment of the invention, an IPG connector header having a header bore for receiving and making electrical connection to a lead connector assembly of an implantable medical device comprises a non-conductive header base and a plurality of electrically conductive header connector elements disposed within the header base. A plurality of electrically insulative fluid seals are interposed between the header connector elements. Each fluid seal has a fluid seal bore and is formed from an elastomeric material and an additive. The additive is formulated to reduce the frictional forces required to insert the lead connector assembly through the fluid seal bores of the fluid seals.


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