The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2009

Filed:

Jul. 19, 2004
Applicants:

Seon-kyeng Kim, Suwon-si, KR;

Wan-jin Choi, Suwon-si, KR;

Ju-hyung Lee, Gwacheon-si, KR;

Jung-ho Park, Suwon-si, KR;

Inventors:

Seon-Kyeng Kim, Suwon-si, KR;

Wan-Jin Choi, Suwon-si, KR;

Ju-Hyung Lee, Gwacheon-si, KR;

Jung-Ho Park, Suwon-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04M 1/00 (2006.01); H04M 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a ground connecting apparatus for a mobile terminal, in which grounds formed on the terminal are directly or indirectly connected so as to reduce an SAR value, thereby adjusting a connection length of the grounds. The ground connecting apparatus for a folder-type mobile terminal, which has a main body including a main body-side ground, a folder including a folder-side ground, a hinge unit and a hinge module, includes a hinge shaft connected to one end of the hinge module; a hinge contact means installed at a designated position on the first PCB so that the hinge contact means is connected to a first PCB-side ground connecting pad provided on the first PCB and adjusts an electrical connection length of the grounds; a pin connector installed at the other end of the hinge module; and a hinge connecting means installed at the pin connector so that the hinge connecting means is connected to a second PCB-side ground connecting pad provided on the second PCB and adjusts the electrical connection length of the grounds.


Find Patent Forward Citations

Loading…