The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2009
Filed:
Jun. 06, 2006
Shinji Yuri, Kasugai, JP;
Masaki Muramatsu, Komaki, JP;
Shinji Yuri, Kasugai, JP;
Masaki Muramatsu, Komaki, JP;
NGK Spark Plug Co., Ltd., Aichi, JP;
Abstract
A wiring board includes a plurality of via pads disposed on a ceramic sub-core accommodated in a core board. A Cu-plated layer is formed on the surface of a conductor pad and serves as a processed face, i.e., a face to which Cu surface chemical processing is applied in order to improve the adhesion between the surface of the Cu-plated layer and that of an adjacent polymer material. The lowermost dielectric layer of a laminated wiring portion, and a via conductor formed in the dielectric layer, are in electrical contact with the processed face.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile