The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2009
Filed:
Feb. 18, 2005
Applicants:
Takashi Tetsuka, Kanagawa, JP;
Hiroki Yamamoto, Kanagawa, JP;
Inventors:
Takashi Tetsuka, Kanagawa, JP;
Hiroki Yamamoto, Kanagawa, JP;
Assignee:
NEC Electronics Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); B21D 53/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package is provided with a low thermal conductivity plate that covers an entire upper surface of a heat dissipating component, by which heat dissipation from the heat dissipating component can be inhibited during a reflow process. Accordingly, sufficient heat can be transmitted to solder balls, so as to heat the solder balls up to a desired temperature. As a result, the semiconductor package and a substrate can be fully bonded via the solder balls, and thereby an excellent mounting performance is achieved.