The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2009
Filed:
May. 21, 2004
Gary R. Lauterbach, Los Altos Hills, CA (US);
Danny Cohen, Pacific Palisades, CA (US);
Robert J. Drost, Mountain View, CA (US);
Gary R. Lauterbach, Los Altos Hills, CA (US);
Danny Cohen, Pacific Palisades, CA (US);
Robert J. Drost, Mountain View, CA (US);
Sun Microsystems, Inc, Santa Clara, CA (US);
Abstract
A plurality of integrated circuit packages are disposed on a substrate. The plurality of integrated circuit packages includes a first type of integrated circuit package that has an inactive side facing the substrate and an active side facing away from the substrate. The plurality of integrated circuit packages also includes a second type of integrated circuit package that has an inactive side facing away from the substrate and an active side facing the substrate. The first type of integrated circuit package and the second type of integrated circuit package are disposed such that a proximity communication enabled portion of the first type of integrated circuit package is aligned with a proximity communication enabled portion of the second type of integrated circuit package.