The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2009
Filed:
Sep. 09, 2005
Hideaki Takemori, Hitachinaka, JP;
Satoshi Higashiyama, Hitachinaka, JP;
Kenji Mori, Haruhi, JP;
Ryoichi Tohmon, Haruhi, JP;
Minoru Hirose, Haruhi, JP;
Hiroaki Kawaguchi, Haruhi, JP;
Hideaki Takemori, Hitachinaka, JP;
Satoshi Higashiyama, Hitachinaka, JP;
Kenji Mori, Haruhi, JP;
Ryoichi Tohmon, Haruhi, JP;
Minoru Hirose, Haruhi, JP;
Hiroaki Kawaguchi, Haruhi, JP;
Hitachi Kyowa Engineering Co., Ltd., Hitachi-shi, JP;
Toyoda Gosei Co., Ltd., Nishikasugai-gun, JP;
Abstract
A submount for a light emitting diode and its manufacturing method, the submount including a reflector and having a compact size. The submount for the light emitting diode comprises a Si base substrate having input/output terminals formed on a front side thereof, and a Si reflector having a sloped through hole and a reflecting film formed at least on a slope defining the through hole. The Si reflector is mounted on the Si base substrate and is fixedly joined to the Si base substrate. The Si reflector and the Si base substrate are joined to each other by a thin film solder.