The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2009
Filed:
Feb. 09, 2005
Nobuto Terada, Tsukuba, JP;
Naoto Shioi, Tsukuba, JP;
Masashi Totokawa, Kariya, JP;
Yasunori Ninomiya, Kariya, JP;
Nobuto Terada, Tsukuba, JP;
Naoto Shioi, Tsukuba, JP;
Masashi Totokawa, Kariya, JP;
Yasunori Ninomiya, Kariya, JP;
Harima Chemicals, Inc., Hyogo, JP;
Denso Corporation, Aichi, JP;
Abstract
The present invention provides a conductive adhesive that is applicable as means for forming conductive junction to process for surface mounting of electronic parts for vehicle loading and process for the manufacture of the electronic parts per se for the purpose of substituting soldering therewith. The conductive adhesive according to the present invention is a conductive adhesive produced by dispersing a conductive medium, such as silver powder, in a binder resin component of a one-component epoxy thermosetting resin which has such a composition that the resin comprises, as essential components, an epoxy resin component composed mainly of an epoxy compound with a polycyclic aromatic ring skeleton, and a cyclic acid anhydride as a curing agent component thereof, and is further added with a coupling agent as an adherence imparting agent therefor.