The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2009
Filed:
Jun. 08, 2006
Applicant:
Ichio Yudasaka, Chino, JP;
Inventor:
Ichio Yudasaka, Chino, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wiring substrate includes a substrate, a first film, and a second film formed between the substrate and the first film, and an empty space is formed between at least a part of the second film and the substrate.
Quick Actions:
Yudasaka, Ichio. (2009). Wiring substrate, electro-optic device, electric apparatus, method of manufacturing wiring substrate, method of manufacturing electro-optic device, and method of manufacturing electric apparatus (U.S. Patent No. 7524734). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7524734
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