The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7524704 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 28, 2009

Filed:

Aug. 14, 2006
Applicant:

François Marion, Saint Martin le Vinoux, FR;

Inventor:

François Marion, Saint Martin le Vinoux, FR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for encapsulating a component by using a chamber in which there is a vacuum or controlled atmosphere, positioning a continuous sealing seam made of a metal or a metal alloy on a wettable surface previously placed on a substrate including at least one component and extending around the periphery of the component(s), positioning a package on the sealing seam, and raising the temperature inside the chamber to fuse the material that constitutes the sealing seam, thereby causing the package to drop onto the substrate and form a leaktight, hermetic seal between the package and the substrate.


Find Patent Forward Citations

Marion, François. (2009). Method for encapsulating a component, especially an electric or electronic component, by means of an improved solder seam (U.S. Patent No. 7524704). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7524704

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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