The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2009
Filed:
Mar. 23, 2007
Applicants:
Chen-fu Chu, Hsinchu, TW;
Hao-chun Cheng, Donggang Township, Pingtung County, TW;
Feng-hsu Fan, Jhonghe, TW;
Wen-huang Liu, Bei-Shan Village, TW;
Chao-chen Cheng, Hsinchu, TW;
Inventors:
Chen-Fu Chu, Hsinchu, TW;
Hao-Chun Cheng, Donggang Township, Pingtung County, TW;
Feng-Hsu Fan, Jhonghe, TW;
Wen-Huang Liu, Bei-Shan Village, TW;
Chao-Chen Cheng, Hsinchu, TW;
Assignee:
Semileds Corporation, Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods are provided for fabricating a semiconductor light-emitting diode (LED) device by providing an LED wafer assembly having an LED stack and selectively roughening and/or texturing a light-emitting surface of the LED stack's n-doped layer. In this manner, light extraction from the LED device is improved.