The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2009
Filed:
Oct. 29, 2003
Toshiko Yokota, Saitama, JP;
Tetsuhiro Matsunaga, Saitama, JP;
Susumu Takahashi, Saitama, JP;
Hideaki Matsushima, Saitama, JP;
Takuya Yamamoto, Saitama, JP;
Makoto Dobashi, Saitama, JP;
Toshiko Yokota, Saitama, JP;
Tetsuhiro Matsunaga, Saitama, JP;
Susumu Takahashi, Saitama, JP;
Hideaki Matsushima, Saitama, JP;
Takuya Yamamoto, Saitama, JP;
Makoto Dobashi, Saitama, JP;
Mitsui Mining and Smelting Co., Ltd., Tokyo, JP;
Abstract
To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method. In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layeris an inorganic-oxide sputter film having a thickness of 1.0 μm or less and formed on the one side of the copper foil in accordance with the sputtering vapor deposition method and the dielectric-layer-provided copper foils for respectively forming a capacitor layer, characterized in that a pit-like defective portion generated on the inorganic-oxide sputter film is sealed by polyimide resin are used.