The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2009
Filed:
Mar. 20, 2003
Shoichiro Usui, Senda, JP;
Shoichiro Usui, Senda, JP;
Usui Kokusai Sangyo Kaisha, Ltd., Shizuoka, JP;
Abstract
As an efficient and economical bonding method indispensable for the bonding between dimension-small constituent elements (members, parts) to manufacture a minute (micro) structure, a micromachine, etc. is provided a bonding method using a capillary condensation effect characterized in that in order to bond at least two separated bonding targets (works) at a prescribed joint point, the bonding targets are disposed under an atmosphere comprising a prescribed vapor pressure of adhesive agent, and the adhesive agent is subjected to capillary condensation at the joint point to thereby form uniform meniscus and bond the bonding targets (works) by the adhesive agent constituting the meniscus.