The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2009

Filed:

Mar. 22, 2006
Applicants:

Aurelio J. Gutierrez, Bonita, CA (US);

Victor H. Renteria, Poway, CA (US);

Russell L. Machado, San Diego, CA (US);

Chris Schaffer, Fallbrook, CA (US);

Henry Hinrichs, San Diego, CA (US);

Inventors:

Aurelio J. Gutierrez, Bonita, CA (US);

Victor H. Renteria, Poway, CA (US);

Russell L. Machado, San Diego, CA (US);

Chris Schaffer, Fallbrook, CA (US);

Henry Hinrichs, San Diego, CA (US);

Assignee:

Pulse Engineering, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/00 (2006.01); H01R 13/648 (2006.01);
U.S. Cl.
CPC ...
Abstract

An advanced connector assembly enabled to receive and distribute power signals. In one embodiment, the connector comprises a single port modular jack, and incorporates an insert assembly disposed in the rear portion of the connector housing. The insert assembly includes first and second substrates and a cavity adapted to receive one or more electronic or signal conditioning components. Heat removal features are also utilized within the jack to effectively dissipate heat produced by the electronic or signal conditioning components. The insert assembly is also optionally made removable from the jack housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet, 10/100, etc.). Methods for manufacturing the aforementioned embodiments are also disclosed.


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