The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2009
Filed:
May. 24, 2007
Chih-chung Chu, Taoyuan County, TW;
Shih-tsung Lin, Taoyuan County, TW;
Hsien-chieh Lin, Taoyuan County, TW;
Chih-Chung Chu, Taoyuan County, TW;
Shih-Tsung Lin, Taoyuan County, TW;
Hsien-Chieh Lin, Taoyuan County, TW;
Nan Ya Printed Circuit Board Corporation, Luchu, Taoyuan, TW;
Abstract
A solder pad structure includes a first metal layer disposed on an insulation layer, wherein the first metal layer is electrically connected with an underlying interconnection circuit layer through a conductive through hole disposed in the insulation layer. A solder resist layer having an opening exposing a central portion of the first metal layer is disposed on the insulating layer. A pillar-shaped second metal layer is disposed within the opening directly on the first metal layer. A solder ball filled into the opening is in contact with the pillar-shaped second metal layer.