The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2009
Filed:
Sep. 23, 2005
Applicants:
Hyo-jae Bang, Cheonan-si, KR;
Byung-man Kim, Cheonan-si, KR;
Dong-chun Lee, Cheonan-si, KR;
Kwang-su Yu, Cheonan-si, KR;
Inventors:
Hyo-Jae Bang, Cheonan-si, KR;
Byung-Man Kim, Cheonan-si, KR;
Dong-Chun Lee, Cheonan-si, KR;
Kwang-Su Yu, Cheonan-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/00 (2006.01); H05K 1/14 (2006.01); H01R 12/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor module and a method of manufacturing a semiconductor module including at least one chip package, at least one module board, at least one conductive element provided between the first chip package and the module board and a protector for applying pressure to the conductive element, the module board, and the first chip package and/or acting as a heat sink for the first chip package.