The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2009
Filed:
Sep. 09, 2004
Yoshiharu Ogata, Sakata, JP;
Yoshiharu Ogata, Sakata, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A method of manufacturing a semiconductor device uses a substrate on which an interconnect pattern is formed and on which a protective film is formed to include an opening and to cover the interconnect pattern in a region other than the opening. The method includes: attaching an adhesive sheet to an area including the opening and a boundary between the opening and the protective film so that a void is formed due to a level difference between the interconnect pattern and the substrate; softening the adhesive sheet by heating; and causing a semiconductor chip to adhere to the substrate through the adhesive sheet. The protective film includes a groove which connects with the opening, the adhesive sheet is attached except a part of the groove, and the void is discharged through the groove by heating and softening the adhesive sheet.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile