The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2009
Filed:
Apr. 06, 2004
Masahiro Imaizumi, Kita-ku, JP;
Toyofumi Asano, Saitama, JP;
Naoyuki Ochi, Saitama, JP;
Masahiro Hirano, Ageo, JP;
Sumio Ichimura, Kita-ku, JP;
Masaru Kudo, Saitama, JP;
Katsuhiko Oshimi, Saitama, JP;
Masataka Nakanishi, Saitama, JP;
Yasumasa Akatsuka, Saitama, JP;
Eiichi Nishihara, Kita-ku, JP;
Masayuki Itai, Sanyoonoda, JP;
Masahiro Imaizumi, Kita-ku, JP;
Toyofumi Asano, Saitama, JP;
Naoyuki Ochi, Saitama, JP;
Masahiro Hirano, Ageo, JP;
Sumio Ichimura, Kita-ku, JP;
Masaru Kudo, Saitama, JP;
Katsuhiko Oshimi, Saitama, JP;
Masataka Nakanishi, Saitama, JP;
Yasumasa Akatsuka, Saitama, JP;
Eiichi Nishihara, Kita-ku, JP;
Masayuki Itai, Sanyoonoda, JP;
Nippon Kayaku Kabushiki Kaisha, Tokyo, JP;
Abstract
The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 μm.