The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2009

Filed:

Mar. 31, 2008
Applicants:

Vincent P. Mulligan, Wappingers Falls, NY (US);

Robert F. Florence, Jr., Poughkeepsie, NY (US);

Michael J. Domitrovits, New Paltz, NY (US);

Tak O. Leung, Poughkeepsie, NY (US);

Inventors:

Vincent P. Mulligan, Wappingers Falls, NY (US);

Robert F. Florence, Jr., Poughkeepsie, NY (US);

Michael J. Domitrovits, New Paltz, NY (US);

Tak O. Leung, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of using a coil contact as an electrical interconnect includes inserting at least one coil contact into a dielectric plate or housing. The at least one coil contact includes a beryllium copper coil plated with gold and having a tapered shape such that each end has a diameter smaller than the diameter of a middle section. The housing comprises an upper half comprising a surface that slopes outwardly from a center of the housing towards a top opening, and a lower half comprising a surface that slopes outwardly from the center of the housing to a bottom opening. The sloping surfaces of the upper half and the lower half form a concave shape that captivates the middle section of the coil contact. Each end of the at least one coil contact extends to account for variations in surfaces of the processor and the circuit board.


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